A series of fluorine-containing bismaleimide (FBMI) monomers were synthesized and added through blending to general epoxy system for application of low-dielectric content (Dk) materials. The thermal analysis and dielectric property of the FBMI monomers in bisphenol-type epoxy system has been discussed. An increase in the FBMI contents decreases the glass-transition temperature (Tg) and slightly reduces the mechanical strength of the epoxy blends. Although the initial pyrolysis temperature of all the blending systems gradually decreases as the fluorinecontent increased, all the fluorine-containing epoxy systems still had good thermal stability. The FBMI-blends exhibit improved dielectric properties as compared with commercial epoxies with the dielectric constants (Dk) lower than 3.07.